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authorPaul Mackerras <paulus@samba.org>2007-12-10 15:41:22 +1100
committerPaul Mackerras <paulus@samba.org>2007-12-10 15:41:22 +1100
commitb242a60206881559bb3102110048762422e6b74e (patch)
tree86459efa47b9c3f69d865b4495beede9c4184003 /Documentation/networking/bonding.txt
parente1fd18656c2963e383d67b7006c0e06c9c1d9c79 (diff)
parent94545baded0bfbabdc30a3a4cb48b3db479dd6ef (diff)
Merge branch 'linux-2.6'
Diffstat (limited to 'Documentation/networking/bonding.txt')
-rw-r--r--Documentation/networking/bonding.txt29
1 files changed, 27 insertions, 2 deletions
diff --git a/Documentation/networking/bonding.txt b/Documentation/networking/bonding.txt
index 11340625e363..6cc30e0d5795 100644
--- a/Documentation/networking/bonding.txt
+++ b/Documentation/networking/bonding.txt
@@ -554,6 +554,30 @@ xmit_hash_policy
This algorithm is 802.3ad compliant.
+ layer2+3
+
+ This policy uses a combination of layer2 and layer3
+ protocol information to generate the hash.
+
+ Uses XOR of hardware MAC addresses and IP addresses to
+ generate the hash. The formula is
+
+ (((source IP XOR dest IP) AND 0xffff) XOR
+ ( source MAC XOR destination MAC ))
+ modulo slave count
+
+ This algorithm will place all traffic to a particular
+ network peer on the same slave. For non-IP traffic,
+ the formula is the same as for the layer2 transmit
+ hash policy.
+
+ This policy is intended to provide a more balanced
+ distribution of traffic than layer2 alone, especially
+ in environments where a layer3 gateway device is
+ required to reach most destinations.
+
+ This algorithm is 802.3ad complient.
+
layer3+4
This policy uses upper layer protocol information,
@@ -589,8 +613,9 @@ xmit_hash_policy
or may not tolerate this noncompliance.
The default value is layer2. This option was added in bonding
-version 2.6.3. In earlier versions of bonding, this parameter does
-not exist, and the layer2 policy is the only policy.
+ version 2.6.3. In earlier versions of bonding, this parameter
+ does not exist, and the layer2 policy is the only policy. The
+ layer2+3 value was added for bonding version 3.2.2.
3. Configuring Bonding Devices