diff options
| author | Anton Tikhomirov <av.tikhomirov@samsung.com> | 2012-02-15 17:04:56 +0900 |
|---|---|---|
| committer | Felipe Balbi <balbi@ti.com> | 2012-03-02 12:11:28 +0200 |
| commit | d28a9689c93195d39f91f35a9519876688605b65 (patch) | |
| tree | 39d7c0b3f80657039cefc3996c20010bdbabbed0 /include/asm-generic/iomap.h | |
| parent | f6bafc6a1c9d58f0c234ac5052b9c09b0747348c (diff) | |
usb: dwc3: Add Exynos Specific Glue layer
Adds Exynos Specific Glue layer to support USB peripherals
on Samsung Exynos5 chips.
[ balbi@ti.com : prevent compilation of Exynos glue layer
on platforms which don't provide clk API implementation ]
Signed-off-by: Anton Tikhomirov <av.tikhomirov@samsung.com>
Signed-off-by: Felipe Balbi <balbi@ti.com>
Diffstat (limited to 'include/asm-generic/iomap.h')
0 files changed, 0 insertions, 0 deletions